127 mau mea hoʻomaka i hoʻonui i $2.6 biliona, me ke kālā nui i hāpai ʻia e ka pilina kikowaena data, quantum computing a me nā pihi.
ʻO Nowemapa ka mahina o nā pōʻai kālā nui, me 10 mau hui i loaʻa ma kahi o $100 miliona ma ke kālā. ʻO kekahi kahi hoʻomaka e hāʻawi i nā ʻōnaehana hoʻopili kikowaena data a me nā hana mempool i ka mea hou loa i ka maʻamau CXL. I kēia mahina, ua hui pū ʻia ʻelua mau mea hoʻomaka computing quantum i ka hui $100 miliona+: ke hoʻohana nei kekahi i nā ʻātoma anuanu loa e hiki ai ke hana i ka computing quantum wale nō, akā, ʻo nā uaki atomic a me ka lekiō, a ke noi nei kekahi i kahi ala photonic e hoʻokō ai i nā lele quantum i hiki ke loaʻa. loaʻa me ke kōkua o kahi mea kanu no ka hana ʻana i nā ʻōnaehana hoʻomanawanui hewa hou no ka hana ʻana i nā microcircuits.
ʻO nā pōʻai kālā nui ʻelua i kēia mahina i hele i nā mea hana pākahi EV, a ke hoʻohana nei nā hui ʻelua i ke kālā e hoʻonui i ka hana. Hana maikaʻi nā ʻoihana no ka mahina, me 23 mau hui i hōʻike ʻia ma kēia hōʻike, ʻo ka huina kālā kiʻekiʻe loa ma ka ʻoihana ʻoihana. Ke nānā nei nā mea hoʻolale kālā ma mua o ka hana ʻana i ka pākaukau: Ua loaʻa kālā kekahi mau mea hoʻomaka e hāʻawi i ke ola ʻelua i nā pihi EV i kūpono ʻole no ke kaʻa a hoʻomaikaʻi i ke kaʻina hana hou.
Loaʻa ka nele o ke kālā no nā ʻoihana ʻoihana AI i kēia mahina. Eia nō naʻe, nui nā ʻenehana hoihoi ʻē aʻe i loaʻa kālā, me ka MEMS foundries, interposerless chip interconnects, electrical rule checking, and 3D imaging of any screen. Eia he 127 mau mea hoʻomaka i hōʻiliʻili ʻia ma luna o $ 2.6 biliona i Nowemapa 2022.
Ua hāpai ʻo Astera Labs i $150.0M ma ke kālā Series D i alakaʻi ʻia e Fidelity Management & Research, i hui pū ʻia e nā mea hoʻopukapuka ʻē aʻe e like me Atreides Management, Intel Capital, a me Sutter Hill Ventures. Ua hāpai ʻo Astera Labs i $150.0M ma ke kālā Series D i alakaʻi ʻia e Fidelity Management & Research, i hui pū ʻia e nā mea hoʻopukapuka ʻē aʻe e like me Atreides Management, Intel Capital, a me Sutter Hill Ventures. Astera Labs привлекла 150 миллионов долларов в рамках финансирования серии D под руководством Fidelity Management & Research, к которым присщедиледин есторы, включая Atreides Management, Intel Capital a me Sutter Hill Ventures. Ua hoʻonui ʻo Astera Labs i $150 miliona ma ke kālā Series D i alakaʻi ʻia e Fidelity Management & Research i hui pū ʻia e nā mea hoʻopukapuka ʻē aʻe me Atreides Management, Intel Capital a me Sutter Hill Ventures. Astera Labs 在由Fidelity Management & Research 牵头的D 轮融资中筹集了1.5 亿美元，其他现有投资者也跟投が包所投资者也跟投が包所投が包。 Astera Labs 在由Fidelity Management & Research Astera Labs 150 миллионов долларов в рамках финансирования серии D под руководством Fidelity Management & Research при участии других сулгих чая Atreides Management, Intel Capital a me Sutter Hill Ventures. Ua hoʻonui ʻo Astera Labs i $150 miliona ma ke kālā Series D i alakaʻi ʻia e Fidelity Management & Research me ke komo ʻana mai nā mea hoʻopukapuka ʻē aʻe e like me Atreides Management, Intel Capital a me Sutter Hill Ventures.Hāʻawi ʻo Astera Labs i nā ʻikepili a me nā hoʻonā hoʻohui hoʻomanaʻo no nā kikowaena ʻikepili. Hāʻawi ia i kahi ʻohana o nā retimers naʻauao no Compute Express Link (CXL) 2.0 a me PCI Express (PCIe) 4.0/5.0 no nā kikowaena hana kiʻekiʻe, mālama, kapua a me nā ʻōnaehana i hoʻopaʻa ʻia i ka hana. Hāʻawi pū ia i nā modula uwea Ethernet naʻauao e lanakila ai i ka laulā, ka hōʻailona hōʻailona, a me nā pilikia hoʻohana bandwidth ma 100G/channel Ethernet pili no ka hoʻololi ʻana a me nā noi hoʻololi-i-server. ʻO ka huahana hou loa a Astera Labs he kahua hoʻopili hoʻomanaʻo e hoʻohana ana i ka maʻamau CXL e kākoʻo i ka hoʻonui ʻana i ka hoʻomanaʻo, ka hoʻomanaʻo ʻana i ka hoʻomanaʻo, a me ka kaʻana like ʻana i ka hoʻomanaʻo ʻana i nā hanauna hou heterogeneous a composable data center architectures. ʻO ke keʻena nui ma Santa Clara, Kaleponi, USA, ua hoʻokumu ʻia ma 2017.
Ua hoʻopau ʻo Eliyan Corporation i kahi $ 40 miliona Series A puni i alakaʻi ʻia e Tracker Capital, a ukali ʻia e Celesta Capital a me nā mea hoʻopukapuka hoʻolālā me Intel Capital a me Micron Ventures. Holo ka ʻenehana chiplet interconnect ʻo Eliyan ma luna o nā substrates organik a ʻaʻole koi i nā hoʻonā hoʻopihapiha holomua e like me nā mea hoʻololi silicon. ʻO kāna ʻenehana NuLink, kahi superset o Bunch of Wire (BoW) a me Universal Chiplet Interconnect Express (UCIe), he pololei (D2D) PHY e hoʻohui i nā hana like ʻole i loko o kahi pūʻulu hoʻokahi ma kekahi mea lawe. Ua ʻōlelo ʻo Elian, ua pāpālua nā ʻenehana lipine 5nm hou i ka bandwidth i ka wā e hoʻopau ana i ka hapalua o ka mana o nā ʻano hana pili o kēia lā. Ua hoʻomohala pū ka hui i nā ʻenehana e hoʻokō i ka 2.5/3D e hiki ke hoʻohui a hoʻohālikelike i nā chiplets me nā pilina like ʻole ma waena o nā chips i nā kaʻina like ʻole e like me DRAM a me SOI. ʻO Eliyan CEO a me ka mea hoʻokumu ʻo Ramin Farjadrad. "Ke kākoʻo nei kā mākou alahele a kūlike me ka hoʻololi ʻana o ka ʻoihana i nā protocols interconnected chip-optimized, me ka maʻamau UCIe, a me ka protocol High-Bandwidth Memory (HBM)." . ʻO ke keʻena nui ma Santa Clara, Kaleponi, USA, i hoʻokumu ʻia ma 2021.
Ua hoʻonui ʻo Cornelis Networks i $29 miliona ma ke kālā Series B i alakaʻi ʻia e IAG Capital Partners me ke komo ʻana mai Adit Ventures, Foresight Group, Intel Capital, KittyHawk Ventures, Ridgeline Partners a me SQN Venture Partners. Hoʻokumu ʻo Cornelis Networks i nā pilina hana kiʻekiʻe e hoʻolalelale i nā haʻahaʻa hana computing ʻenehana ma HPC, AI a me ML. Hoʻolālā ʻia ka Accelerated Host Fabric Adapter e hāʻawi i ka hoʻohālikelike semantic ma waena o nā noi HPC maoli a me nā lole hiki ke hoʻonui ʻia me ka hiki ke hoʻonui ʻia i nā hoʻonui 100 Gb/s, 250 MPI memo i kēlā me kēia kekona, a me sub-microsecond MPI latency. kāleka, hoʻololi lihi, hoʻololi pae alakaʻi, ʻīpuka a me nā kaula. E hoʻohana ʻia ke kālā no ka hoʻonui ʻana i ka hiki o ka ʻoihana hele i ka mākeke a me ka wikiwiki i ka hoʻokō ʻana i kāna palapala alanui. Hoʻokumu ʻia ma 2020 a ʻo ke keʻena nui ma Wayne, Pennsylvania, USA.
Ua hāpai ʻo Beizhong Netcom i ke kālā Pre-A Series mai Rising Investments. Ke hoʻomohala nei ka hoʻomaka ʻana i nā Unit Processing Data (DPUs) no nā SmartNIC a me nā chips cybersecurity programmable. ʻO ke poʻo nui ma Chengdu, Kina, ua hoʻokumu ʻia ma 2020.
Ua loaʻa iā LinJoWing nā hoʻopukapuka ʻānela mai SDIC, Huaxia Capital a me Changjiang Securities. Hoʻokumu ʻo LinJoWing i nā chips no nā GPU a me nā kāleka wikiō. Hoʻopili ʻia kāna mau huahana i kēia manawa i nā kamepiula desktop, nā noi kiʻi i hoʻopili ʻia, nā kamepiula hoʻokele ʻenehana, a me nā noi koa. ʻO ke keʻena nui ma Wuhan, Kina, i hoʻokumu ʻia ma 2021.
Ua hoʻonui ʻo X-Epic i mau haneli miliona o yuan (100 miliona yuan a i ʻole $13.9 miliona) ma ke kālā Series B i alakaʻi ʻia e CICC Capital, China Electronics Corporation a me Wuhan Optics Valley United Group, me Mirae Asset a me Henglu Assets ma hope o ka hoʻokō. Hāʻawi ʻo X-Epic i kahi pūʻulu o nā mea hana hōʻoia, me kahi ʻōnaehana prototyping FPGA, kahi simulator kikohoʻe, kahi ʻōnaehana hōʻoia ʻōlelo holomua e pili ana i ka Portable Stimulus Standard (PSS) no ka hoʻokumu ʻana i ka hihia hoʻāʻo ʻokoʻa, kahi hōʻoia kūpono e pili ana i ka huaʻōlelo, kahi simulation. , a me kahi hoʻonā debugging. Hāʻawi pū ʻo ia i nā ʻōlelo aʻoaʻo hōʻoia. E hoʻohana ʻia ke kālā no ka hoʻonui ʻana i ka nui o nā huahana a me ka hoʻolimalima. Ua hoʻokumu ʻia ke keʻena nui ma Nanjing, Kina ma 2020.
Ua hoʻonui ʻo Aniah i 6 miliona euros ($6.2 miliona) ma ke kālā Series A i alakaʻi ʻia e Supernova Invest, me nā haʻawina mai BNP Invest, Crédit Agricole Sud Rhône-Alpes a me Bpifrance. Hoʻokumu ʻo Aniah i nā polokalamu hōʻoia kānāwai uila piha piha. Manaʻo ʻo ia e hāʻawi i nā ʻenekini hoʻolālā analog a me nā kikohoʻe i nā pōmaikaʻi o ka hōʻoia ʻana o ka transistor-level verification a me ka ʻōlelo ʻana e hiki i kāna mau mea hana ke ʻike pono i nā hewa i ka wā e wikiwiki ana i ka nānā ʻana i ka chip holoʻokoʻa. "Ua hōʻike ʻo Aniah i kahi holomua ʻenehana maoli i ka hoʻopau ʻana i nā hewa hoʻolālā uila i ka ʻoihana semiconductor. ʻO ke ala maʻalahi, aʻoaʻo a me ka ʻike ʻole i nā ʻenekini e hoʻopiʻi i nā mea pāʻani koʻikoʻi i ke kaulahao hana uila e like me ka hōʻoia ʻana e komo nā mea uila e hiki mai ana i ka mākeke i ka manawa kūpono. ka manawa hoʻolaha huahana," wahi a Richard Moustjes, ka luna o ka papa alakaʻi o Aniah. E hoʻohana ʻia ke kālā no ka hoʻonui ʻana i ka honua, ʻoi aku hoʻi ma Asia, ka US, a me ka ʻIseraʻela, a me ka hiki ke hoʻomohala ʻia o nā modules hou no ka nānā ʻana i ka hilinaʻi chip, ka nānā ʻana i ka papahana hoʻolālā, a me ka hoʻolālā kōkua kamepiula i hoʻokumu ʻia e AI. Ua hoʻokumu ʻia ma 2019 a ʻo ia ke keʻena nui ma Grenoble, Farani.
Ua hoʻonui ʻo Atomica Corp i $30 miliona ma ke kālā Series C mai Cerium Technology Ventures, Novo Tellus Capital Partners a me St. cloud capital. ʻO Atomica kahi waihona MEMS me nā kahua kūikawā no nā photonics, sensors, biochips, relays a me nā hoʻololi, a me MEMS kūikawā. Hana ka hui me ka nui o nā kaʻina hana a me nā mea e pili ana i nā metala makamae, polymers a me nā substrates e like me ke silicon, SOI, aniani, fused silica, quartz, borosilicates, piezoceramics a me III-Vs. Ke hana nei ia i kēia manawa he 130,000 square foot manufacturing campus. E hoʻohana ʻia kēia mau kālā no ka hoʻonui ʻana i ka hiki ke kūkulu ʻia a me ka holomua ʻana i ka ʻenehana MEMS. ʻIke mua ʻia ʻo Innovative Micro Technology (IMT), ua hana ʻia ma 2000 ma ke ʻano he hoʻonohonoho hou ʻana o Applied Magnetics Corporation. ʻO ka loaʻa ʻana ma 2018 i loaʻa i kahi mea hou. Aia ia ma Santa Barbara, Kaleponi, USA.
Ua hāpai ʻo Elephantech i 2,150.0M yen (~ $ 14.4M) i ke kālā mai ANRI Investment, Shin-Etsu Chemical, Nose Investment, Shizuoka Capital, Eiwa Corporation, Nanobank, Mitsubishi Gas Chemical, Kebishi Sake Brewing, D&I Investment, Seiko Epson, Sumimoto, East Ventures , a me nā ʻoihana ʻē aʻe. Ua hāpai ʻo Elephantech i 2,150.0M yen (~ $ 14.4M) i ke kālā mai ANRI Investment, Shin-Etsu Chemical, Nose Investment, Shizuoka Capital, Eiwa Corporation, Nanobank, Mitsubishi Gas Chemical, Kebishi Sake Brewing, D&I Investment, Seiko Epson, Sumimoto, East Ventures , a me nā ʻoihana ʻē aʻe. Elephantech привлекла 2 150,0 млн иен (~ 14,4 млн долларов США) от ANRI Investment, Shin-Etsu Chemical, Nose Investment, Shizuoka Capital, Eiwa Corporation, Nanobank, Mitsubishi Gas Chemical, Kebishi Sake Investment Brewing, D&B. , Sumimotos, East Venture. Ua hāpai ʻo Elephantech i ¥2,150.0 miliona (~ $ 14.4 miliona) mai ANRI Investment, Shin-Etsu Chemical, Nose Investment, Shizuoka Capital, Eiwa Corporation, Nanobank, Mitsubishi Gas Chemical, Kebishi Sake Brewing, D&I Investment, Seiko Epson, Sumimotos, East Venture.a me nā ʻoihana ʻē aʻe. Elephantech 从ANRI Investment, Shin-Etsu Chemical, Nose Investment, Shizuoka Capital, Eiwa Corporation, Nanobank, Mitsubishi Gas Chemical, Kebishi Sake Brewing, D&I Investment, Seiko Epson, Sumimoto, East Ventures.合1440 万美元）的资金和Beyond Next Ventures。 ʻO Elephantech 从ANRI Investment, Shin-Etsu Chemical, Nose Investment, Shizuoka Capital, Eiwa Corporation, Nanobank, Mitsubishi Gas Chemical, Kebishi Sake Brewing, D&I Investment, Seiko Epson, Sumimoto, East Ventures i hoʻonui ʻia he 21 US $) kālā a me Beyond Next Ventures.Ua hoʻonui ʻo Elephantech i ¥2.15 biliona (ma kahi o $14.4 miliona) i ke kālā mai Beyond Next Ventures.Hāʻawi ʻo Elephantech i kahi ʻenehana no ka hana ʻana i nā papa kaapuni paʻi e pili ana i ka paʻi ʻana i ka inkjet, ka mea i ʻōlelo ʻia he ʻano kūlohelohe, e hōʻemi ana i ka hoʻokuʻu ʻana o CO2 e 77% a me ka hoʻohana ʻana i ka wai e 95% i hoʻohālikelike ʻia i nā ʻano hana kuʻuna. Ua ʻōlelo ka mea hoʻomaka e hiki ke hoʻohana ʻia kāna ʻenehana i nā ʻano ʻano o ka papa kaapuni paʻi. I kēia manawa, ʻo ka manaʻo nui e pili ana i nā substrates maʻalahi hoʻokahi ʻaoʻao, a i ka wā e hiki mai ana ua hoʻolālā ʻia e hoʻokuʻu i nā papa kaapuni multilayer a paʻi paʻi. ʻO ia ka manaʻo e hoʻonui i nā hiki ke paʻi ʻia ma nā substrates biomass a me ka hoʻohana ʻana i nā mea hana hou. E hoʻohana ʻia ke kālā no ka hoʻonui honua a me ka hoʻonui ʻana i ka noi o kēia ʻenehana. Hoʻokumu ʻia ma 2014 me ke keʻena nui ma Tokyo, Iapana.
Ua hōʻiliʻili ʻo CanSemi i mau haneli miliona yuan (100 miliona yuan, a i ʻole $13.9 miliona) i ka pūʻulu B series me nā hoʻopukapuka kālā mai Guangzhou Kechuang Industry Investment Fund, Guangdong Semiconductor a me Integrated Circuit Industry Investment Fund a me CCB Capital. ʻO CanSemi kahi 12 ″ analog wafer foundry kūikawā i waena o nā kiʻekiʻe kiʻekiʻe a me nā IC analog. ʻO nā papa mua ʻelua o kāna papahana, e pili ana i ka hana ʻana i ka ʻenehana kaʻina hana 180-90 nm, a laila ua hoʻopau ʻia ka ʻenehana hana 90-55 nm. E hoʻohana ʻia ke kālā no ke kolu o ka pae, e hoʻonui ana i nā nodes i loaʻa i 55-40nm. Manaʻo ʻia ma hope o ka pau ʻana o ke kolu o ka pae, e hana ʻia ma kahi o 80,000 mau papa 12-iniha i kēlā me kēia mahina. Hoʻolālā ka ʻoihana e hoʻohana i kahi kaʻina hana 22nm. Hoʻokumu ʻia ma 2017 a he keʻena nui ma Guangzhou, Kina.
Ua hoʻonui ʻo Getech Technology i mau haneli miliona o yuan (100 miliona yuan a i ʻole $13.9 miliona) i kahi pōʻai B Series mai SAIC nona Hengxu Capital a me Guangdong Financial Fund. Hoʻokumu ʻo Getech i nā polokalamu kamepiula-integrated manufacturing (CIM) no ka hana semiconductor a me nā ʻoihana ʻē aʻe, me ka ikehu hou, nā mea uila a me nā kaʻa. Hoʻopili nā huahana i ka hana ʻana o ka pā, hoʻopaʻa ʻana a me ka hoʻāʻo ʻana, a hoʻopau i ka hui ʻana o nā huahana, a kākoʻo i ka hoʻokele hana ʻana i nā hale kūʻai lehulehu a me nā hale hana. E hoʻohana ʻia nā kālā e hoʻonui i ka hoʻopukapuka ʻana i nā huahana semiconductor, me ka manaʻo nui i ka naʻauao artificial a me ka ʻikepili nui no nā polokalamu a me nā polokalamu algorithmic. Ua hoʻokumu ʻia ʻo TCL ma 2018 a ua hoʻokumu ʻia ma Guangzhou, Kina.
Ua hoʻonui ʻo NeuCloud i nā haneli miliona o yuan (100 miliona yuan a i ʻole US $13.9 miliona) ma ke kālā Series C+ mai ka Beijing Integrated Circuit Equipment Industry Fund, CRRC Capital a me ka China Internet Investment Fund. Hāʻawi ʻo NeuCloud i kahi kahua no ka hōʻiliʻili, mālama ʻana a me ka nānā ʻana i ka ʻikepili ʻoihana. Wahi a ka hui no ka hana semiconductor, hiki ke hoʻohana ʻia kāna paepae e ana i ka hana o nā laina hana IC a ʻike i nā pilikia hoʻopuka. Hiki ke hoʻoili ʻia e nā mea kūʻai aku semiconductor e nānā i ka hana o nā mea hana i ka wā o ka hana a hāʻawi i nā hiki ke mālama i ka huahana. Hoʻohana ʻia ka paepae i nā hana ʻē aʻe, ikehu, petrochemical, kaʻa kaʻa a me nā ʻoihana ʻē aʻe. Hoʻokumu ʻia ma 2013, ke keʻena nui ma Beijing, Kina.
Ua loaʻa iā SRI Intellectual Technology (SRII) he mau haneli miliona RMB (RMB 100 miliona a ma kahi o US $ 13.9 miliona) ma ke kālā Series A mai Oceanpine Capital, Stony Creek Capital, a me nā mea ʻē aʻe. layer deposition (ALD), a me kāna hui ʻo Lumineq, nāna e hoʻopuka i nā hōʻike ʻike maopopo no nā ʻenehana a me nā kaʻa. E hoʻohana ʻia nā kālā no ka R&D a me ka hoʻonui ʻana i ka laina hana. E hoʻohana ʻia nā kālā no ka R&D a me ka hoʻonui ʻana i ka laina hana. E hoʻohana ʻia nā kālā no ka R&D a me ka hoʻomaikaʻi ʻana i ka laina hana.E hoʻohana ʻia nā kālā no ka noiʻi a me ka hoʻomohala ʻana a me ka hana hou o ka laina hana. Ua loaʻa ʻo SRII iā Beneq i ka makahiki 2018. ʻO ke keʻena nui ma Qingdao, Kina, i hoʻokumu ʻia ma ke ʻano he hui hui ma 2018.
Ua hoʻonui ʻo Jet Plasma Technology i 100 miliona yuan (ma kahi o US $ 13.9 miliona) i ke kālā Series D mai PH Investment, Shanghai Lingang Innovation Center, Jucheng Capital, Xu Nuo Capital a me nā mea ʻē aʻe. Hana ka ʻoihana i ka hoʻomaʻemaʻe plasma a me nā lako lapaʻau ʻili no ka hoʻopili ʻana i nā ʻāpana semiconductor, semiconductors composite, nā LED, nā mea kūʻai aku, nā mea uila, a me ka hana ʻana i nā mea hana. ʻO ke poʻo nui ma Shanghai, Kina, ua hoʻokumu ʻia ma 2015.
Ua hoʻonui ʻo Enovate3D ma kahi o 100 miliona yuan (ma kahi o $13.9 miliona) i ke kālā Series A i alakaʻi ʻia e Hikvision, i hui pū ʻia e Sequoia Capital China a me Walden International. Hiki i nā mea paʻi uila 3D i hana ʻia e Enovate3D ke hana i nā hiʻohiʻona liʻiliʻi e like me ka 1 a hiki i ka 10 microns no ka hana hoʻohui ʻana i nā mea hana metala conductive kiʻekiʻe, nā polymers, nā mea dielectric kumu seramika, a me nā mea uila maʻalahi. Hāʻawi pū ia i nā lawelawe paʻi 3D. E hoʻohana ʻia nā kālā no ka R&D, ka hoʻolimalima ʻana, a me ke kūkulu ʻana i kahi kahua hana. E hoʻohana ʻia nā kālā no ka R&D, ka hoʻolimalima ʻana, a me ke kūkulu ʻana i kahi kahua hana.E hoʻohana ʻia nā kālā no ka noiʻi a me ka hoʻomohala ʻana, ka hoʻolimalima ʻana a me ke kūkulu ʻana i kahi kumu hana.E hoʻohana ʻia nā kālā no ka noiʻi a me ka hoʻomohala ʻana, ka hoʻolimalima ʻana a me ke kūkulu ʻana i kahi kumu hana. Hoʻokumu ʻia ma 2020 a ʻo ke keʻena nui ma Hangzhou, Kina.
Ua hoʻonui ʻo Zeta Tech i kahi kokoke i 100 miliona yuan (e pili ana i $ 13.9 miliona) i kahi pōʻai Series A i alakaʻi ʻia e Hefei Industrial Investment Group a me Glory Ventures, me ke komo ʻana mai ke kapikala ʻoihana ʻo South China. Hāʻawi ʻo Zeta Tech i nā polokalamu kamepiula-integrated manufacturing (CIM) no ka hoʻohui ʻana i ka ʻikepili, ka nānā ʻana i ka ʻikepili nui, ka hoʻokele hua, a me ka hoʻohana ʻana i nā lako i ka hana semiconductor a me ka hoʻopili. Hāʻawi pū ia i nā lawelawe kūkākūkā no ka hoʻolālā hana akamai. Ma waho aʻe o nā semiconductors, kūpono hoʻi kāna mau huahana no ka hana ʻana i nā paneli hōʻike, photovoltaic a me nā pā lithium. E hoʻohana ʻia nā kālā no ka R&D, ka hoʻolimalima ʻana, a me ka hoʻololi ʻana i nā huahana, me ka hoʻohui ʻana i ka hana hana, ka hoʻokele maikaʻi ʻana, ka hoʻokele waiwai o nā lako, nā lako lako, a me nā ʻōnaehana ʻē aʻe, a me ka hoʻonui ʻana i ka hoʻohui ʻana me nā ʻikepili nui a me nā noi AI. E hoʻohana ʻia nā kālā no ka R&D, ka hoʻolimalima ʻana, a me ka hoʻololi ʻana i nā huahana, me ka hoʻohui ʻana i ka hana hana, ka hoʻokele maikaʻi ʻana, ka hoʻokele waiwai o nā lako, nā lako lako, a me nā ʻōnaehana ʻē aʻe, a me ka hoʻonui ʻana i ka hoʻohui ʻana me nā ʻikepili nui a me nā noi AI.E hoʻohana ʻia nā kālā no ka noiʻi ʻana a me ka hoʻomohala ʻana, ka hoʻoulu ʻana, a me ka hoʻonui ʻana i ka huahana, me ka hoʻohui ʻana i ka hana ʻana, ka hoʻokele maikaʻi ʻana, ka hoʻokele waiwai o nā lako, nā lako hana, a me nā ʻōnaehana ʻē aʻe, a me ka hoʻoikaika ʻana i ka hoʻohui ʻana me nā ʻikepili nui a me nā noi hana akamai.E hoʻohana ʻia nā kālā no ka noiʻi a me ka hoʻomohala ʻana, ka hoʻopaʻa ʻana, a me ka hoʻonui ʻana i nā huahana, me ka hoʻohui ʻana i nā ʻōnaehana e like me ka hoʻokele hana ʻana, ka hoʻokele maikaʻi, ka hoʻokele waiwai o nā lako, ka mīkini ʻenehana, a me ka hoʻonui ʻana i ka hoʻohui ʻana me nā ʻikepili nui a me nā noi hana akamai. ʻO ke keʻena nui ma Shanghai, Kina, ua hoʻokumu ʻia ma 2017.
ʻO Goodled Precision Optoelectronics, i ʻike ʻia ʻo Goodun, ua hoʻonui ʻo 50 miliona yuan (ma kahi o $7 miliona) i ke kālā A+ series. Hana ʻo Goodun i nā ʻāpana UVA, UVB, UVC a me NIR LED a me nā modula e pili ana i nā hui semiconductor III-V. Hāʻawi ka hui i kēia mau huahana i nā lako hoʻōla UV i hoʻohana ʻia i nā mea uila uila a me ka hana pākaukau, a me nā mea ʻē aʻe. Hoʻokumu ʻia ma 2005, ke keʻena nui ma Changzhou, Kina.
Ua hoʻonui ʻo Amplio i $6 miliona ma ke kālā hua i alakaʻi ʻia e Construct Capital me ke komo ʻana mai Slow Ventures, High Alpha Capital, Flexport Ventures, Alpaca Venture Capital a me nā mea hoʻopukapuka pākahi. Hāʻawi ka hoʻomaka i kahi kahua hoʻokele hoʻolako no nā mea uila. Ua ʻōlelo ka ʻoihana hiki iā ia ke hahai i nā ʻāpana i ka pilikia kiʻekiʻe loa o ka hemahema a hoʻopili i nā mea kūʻai aku i nā kumuwaiwai ʻē aʻe. Hāʻawi pū ia i ka kūʻai pūʻulu e hōʻemi i ke kumukūʻai o ka BOM. Ua hoʻokumu ʻia ma Atlanta, Georgia, USA, ma 2021.
Ua hoʻonui ʻo SparkNano i ka € 5.5 miliona ($ 5.4 miliona) i ke kālā i alakaʻi ʻia e ALIAD Air Liquide me ke komo ʻana mai Somerset Capital Partners, Invest-NL a me nā mea hoʻopukapuka hou ʻo Innovation Industries, Brabant Development Company a me TNO. Ke hoʻomohala nei ʻo SparkNano i ka ʻenehana Spatial ALD no ka hana ʻana i nā electrolyzers no ka hana ʻana i ka hydrogen ʻōmaʻomaʻo, nā wahie wahie, nā pihi, nā pūnaewele lā a me nā hōʻike. Ma kahi o ka hoʻohana ʻana i ke keʻena ʻumeke, wehewehe ka mea hoʻomaka i kāna ʻenehana ma ke ʻano he poʻo paʻi ALD e lana ana ma luna o ka substrate a hāʻawi i nā precursors kinoea i hoʻokaʻawale ʻia mai kekahi i kekahi e kahi pale o ke kinoea inert. Hiki ke hoʻohana ʻia e waiho i kahi ʻano o nā kiʻiʻoniʻoni lahilahi i hoʻohālikelike ʻia a hōʻemi i ka hoʻohana ʻana i nā mea waiwai e like me ka iridium a me ka platinum. Hāʻawi ʻo SparkNano i nā huahana mai nā mea hana R&D maʻalahi a hiki i nā mea hana kiʻekiʻe a me nā ʻāpana nui no ka hana ʻelua pepa-i-pepa a me ka roll-to-roll. Hāʻawi ʻo SparkNano i nā huahana mai nā mea hana R&D maʻalahi a hiki i nā mea hana kiʻekiʻe a me nā ʻāpana nui no ka hana ʻelua pepa-i-pepa a me ka roll-to-roll. Hāʻawi ʻo SparkNano i nā huahana mai nā mea hana R&D maʻalahi i ka leo kiʻekiʻe a me nā mea hana kiʻekiʻe kiʻekiʻe no ka hana pepa a me ka ʻōwili. Loaʻa nā makana a SparkNano mai nā mea hana R&D maʻalahi a hiki i nā mea hana kiʻekiʻe a me nā mea hana nui no ka papa-a-papa a me ka roll-to-roll production.E hoʻohana ʻia ke kālā no ka hoʻonui ʻana i ka ʻoihana. He lālā ia o TNO Holst Center i hoʻokumu ʻia ma 2018 a i hoʻokumu ʻia ma Eindhoven, Netherlands.
Ua loaʻa iā Litilit kahi hoʻopukapuka o 3.5 euros (ma kahi o $ 3.5 miliona) mai Taiwania Capital's Central and Eastern Europe Investment Fund. Hiki ke hoʻohana ʻia nā lasers ultrashort pulsed femtosecond no ka hana ʻana i nā mea uila like ʻole a kūpono i nā PCB paʻa, nā PCB maʻalahi a me nā PCB paʻa. Hoʻohana pū ʻia kāna mau laser i ka hana seramika, multiphoton microscopy a me nā noi olakino. Ua hoʻokumu ʻia ma 2015 a aia ke keʻena nui ma Vilnius, Lithuania.
Ua hoʻonui ʻo Accuracy Int Tech, ʻike ʻia ʻo Akeris Intelligent Equipment, he ʻumi miliona yuan ($1.4 miliona) i ke kālā mai Hefei Angel Fund a me Kewell Technology. Hana ʻo Akeris i nā lako no ka ʻoki ʻana a me ka ʻoki ʻana i nā wafers mai 6″ a i 12″. ʻO ke keʻena nui ma Hefei, Kina, i hoʻokumu ʻia ma 2019.
Ua loaʻa iā Lebo Semi he ʻumi miliona yuan (10 miliona yuan a ma kahi o US $1.4 miliona) ma ke kālā Series A mai Shenzhen Venture Capital a me Zhongmao Capital. Hana ʻo Loeb Semiconductor i nā mea hana no ka hana ʻana i nā semiconductor. Loaʻa i kāna mau huahana ka hoʻopili ʻana a me ka semi-aunoa gluing, ka hoʻomohala ʻana, ka wehe ʻana a me ka hoʻomaʻemaʻe ʻana i nā lako, a me ka formic acid reflow soldering machines. ʻO nā noi nui he semiconductors composite, LED a me MEMS. Hoʻokumu ʻia ma 2013 a he keʻena nui ma Jiangsu, Kina.
Ua loaʻa iā Younme he ʻumi miliona yuan (10 miliona yuan a ma kahi o US $ 1.4 miliona) i kahi pōʻai kālā Pre-A mai Ningbo Huatong Venture Capital a me Suzhou Rongyue Investment. Hoʻomaka ka hoʻomaka ʻana i nā mea hana me ka mana ikaika, i hoʻohana ʻia no ka hana ʻana i nā mea uila uila. Hoʻolālā ka hui e hoʻonui i ka hana ʻana o nā pā lithium a me nā cell photovoltaic. ʻO ke keʻena nui ma Suzhou, Kina, i hoʻokumu ʻia ma 2018.
Ua hoʻonui ʻo GDH i 165 miliona yuan ($23.5 miliona) i ke kālā mai Guangzhou Industrial Investment Group a me nā hui ʻē aʻe. Hāʻawi ka hoʻomaka ʻana i ka pahu wafer-level no nā kiʻi sensor kiʻi, nā mīkini ʻike manamana lima, MEMS, a me nā mea RF. E hoʻohana ʻia ke kālā no ke kūkulu ʻana i kahi laina pahu 8-inch/12-inch through-silicon (TSV) no nā mea ʻike kiʻi CMOS (CIS) a me nā kānana. Hoʻokumu ʻia i ka makahiki 2022 a ua hoʻokumu ʻia ma Guangzhou, Kina.
Ua hoʻonui ʻo CD Micro Technology, ʻo Chengdu Maike hoʻi, he ʻumi miliona yuan (10 miliona yuan a i ʻole $1.4 miliona) ma ke kālā Series A mai Sichuan Development, Deer Laser a me Yizhan Capital. Hoʻopuka ka hui i nā substrates ma o ke aniani ma o (TGV), nā mea hana passive integrated (IPD) a me ke aniani microstructured 3D. Hāʻawi pū ia i nā lawelawe ʻenehana TGV a hoʻomohala i nā lako kaʻina hana TGV no ka pahu 3D, nā polokalamu microwave/THz kiʻekiʻe, optical/RF MEMS, a me nā chip microfluidic. E hoʻohana ʻia nā kālā no ka R&D o nā noi TGV a me ka hana ʻana i ka hana nui. E hoʻohana ʻia nā kālā no ka R&D o nā noi TGV a me ka hana ʻana i ka hana nui.E hoʻohana ʻia ke kālā no ka noiʻi ʻana a me ka hoʻomohala ʻana i nā noi TGV a me ka hana hana nui.E hoʻohana ʻia ke kālā no ka noiʻi a me ka hoʻomohala ʻana a me ka hana nui o nā noi TGV. ʻO ke keʻena nui ma Chengdu, Kina, ua hoʻokumu ʻia ma 2017.
Ua hoʻokomo ʻia ʻo TCPack ma Xingbang Advanced Manufacturing Fund. Hana ka hui i nā pūʻolo metala, nā pūʻolo seramika, nā pūhui wela a me nā pūʻolo liʻiliʻi liʻiliʻi (SOP) no nā lako kamaʻilio optical, nā laser ʻoihana, nā mea ʻike, nā modula RF a me nā uila uila. ʻO ke keʻena nui ma Hefei, Kina, i hoʻokumu ʻia ma 2017.
Ua hoʻonui ʻia ʻo Dongfang Jingyuan Electron Limited (DJEL) ma kahi o CNY 1,000.0M (~ $ 139.6M) i ke kālā kālā pilikino mai Xingcheng Capital, E-town International Investment & Development, Xin Ding Capital, Green Pine Capital Partners, CGII Private Fund, Silk Road Huachuang, ʻO Red Horse Capital, An Xin Capital, CoStone Capital, Five Bulls Fund, China Capital Management, Haier Capital, CCB International, Nuo Capital, a me nā mea ʻē aʻe. ʻO Dongfang Jingyuan Electron Limited (DJEL) привлекла почти 1000,0 млн юаней (~ 139,6 млн долларов США) в виде прямых инвести инвести инвести инвести инвести Пинций Investment Capital & Capital Capital , частного фонда CGII, Silk Road Huachuang, Red Horse Capital, An Xin Capital, CoStone Capital, Five Bulls Fund, China Capital Management, Haier Capital, CCB International, Nuo Capital и другие.Dongfang Jingyuan Electronics Co., Ltd. (DJEL) от Xingcheng Capital, Yizhuang International Investment Development, Xinding Capital, Qingsong Capital, CGII Private Equity Fund, Silk Road Huachuang, Red Horse Capital, Anxin Capital, Cornerstone Capital, Wuniu Fund, Huaxia Capital , Haier Capital, CCB International, NUO Capital и др. DJEL предлагает решения для управления доходностью, программное обеспечение для коррекции оптической близостиброду ( -лучевого контроля, а также 8-дюймовые и 12-дюймовые сканирующие электронные микроскопы критическопы критичесмерох (расклеский). E hoʻohana ʻia nā kālā no ka R&D huahana hou a me ke kūkulu ʻana i nā hale hana.Средства будут использованы для исследований и разработок новых продуктов и строительства производственных мощностейСредства будут направлены на разработку новых продуктов и строительство производственных мощностей. Основана в 2014 году, штаб-квартира находится в Пекине, Китай.
Ua loaʻa iā Mega Phase Technology kahi kokoke i 100 miliona yuan (ma kahi o US $13.9 miliona) ma ke kālā Series B mai Richen Capital. Hoʻokumu ka hoʻomaka ʻana i nā kāmela kamepiula 3D māmā no ka nānā ʻana i nā chips, ka ʻenehana mauna o luna (SMT), nā mea uila uila, nā pā lithium a me nā noi hana kikoʻī ʻē aʻe. E hoʻohana ʻia nā kālā no ka R&D a me ka hoʻonui ʻana i ka mana hana. E hoʻohana ʻia nā kālā no ka R&D a me ka hoʻonui ʻana i ka mana hana.E hoʻohana ʻia nā kālā no ka noiʻi a me ka hoʻomohala ʻana a me ka hoʻonui ʻana i ka mana hana.E hoʻohana ʻia ke kālā no ka noiʻi a me ka hoʻomohala ʻana a me ka hoʻonui ʻana i ka hiki. Hoʻokumu ʻia ma 2014, ke keʻena nui ma Shanghai, Kina.
Ua hoʻonui ʻo LightE Technology i ʻumi miliona yuan (10 miliona yuan a i ʻole US $1.4 miliona) ma ke kālā Series A mai Broadstream Capital. Hana ʻo LightE Technology i nā mea ʻike hoʻoneʻe confocal spectral no ka nānā ʻana o 3D optical o semiconductors, nā papa kaapuni paʻi, nā mea uila uila, nā kiʻi photovoltaic, nā lens a me nā noi ʻē aʻe. Wahi a ka mea hoʻomaka, hāʻawi ka ʻenehana i ka kikoʻī kiʻekiʻe, ʻoi aku ka hoʻohana ʻana i nā mea waiwai, a ʻoi aku ka paʻa ma mua o nā lasers maʻamau. Ke hana nui nei ka hui i nā mea ʻike confocal point a me nā prototypes o nā huahana confocal linear. Hoʻolālā ʻia hoʻi e hoʻomohala i nā mea ʻike hyperspectral + nā ʻike naʻauao artificial a me nā mea ʻike fiber optic. E hoʻohana ʻia nā kālā no ka hana nui ʻana o nā mea ʻike confocal linear a me R&D. E hoʻohana ʻia nā kālā no ka hana nui ʻana o nā mea ʻike confocal linear a me R&D. E hoʻohana ʻia nā kālā no ka hana serial o nā mea ʻike confocal linear a me R&D. E hoʻohana ʻia nā kālā no ka hana nui a me ka R&D o ka linear confocal sensor.ʻO ke keʻena nui ma Shenzhen, Kina, ua hoʻokumu ʻia ma 2014.
Ua loaʻa iā Pi Semiconductor he ʻumi miliona yuan (10 miliona yuan ma kahi o $1.4 miliona) ma ke kālā Series A+ mai Addor Capital. Hoʻokumu ka hoʻomaka ʻana i nā substrates kāleka probe a me nā papa hoʻouka no ka hoʻāʻo wafer a me ka hoʻāʻo hope. Hoʻolālā ka hui e neʻe i nā substrates multilayer organic (MLO) a me nā substrate ceramic. ʻO ke keʻena nui ma Nantong, Kina, i hoʻokumu ʻia ma 2021.
Ua hoʻonui ʻo Weichong Semiconductor i ʻumi miliona yuan (10 miliona yuan a i ʻole $1.4 miliona) i nā pōʻai kālā Pre-A+ a me Pre-A++, me nā hoʻopukapuka kālā mai Huaxia Fuqiang, Sunic Capital a me Yunqi Capital. Hoʻokumu ka hoʻomaka ʻana i nā mea hana no ka hoʻāʻo ʻole ʻana i ka hoʻāʻo ʻole ʻana i nā wafers optical i ka manawa maoli. E hoʻohana ʻia nā kālā no ka R&D, ka hana nui o nā huahana mua, a me ka hoʻolimalima ʻana. E hoʻohana ʻia nā kālā no ka R&D, ka hana nui o nā huahana mua, a me ka hoʻolimalima ʻana.E hoʻohana ʻia nā kālā no ka noiʻi a me ka hoʻomohala ʻana, ka hana nui ʻana o nā huahana o ka hanauna mua, a me ka hoʻopaʻa ʻana i nā limahana.E hoʻohana ʻia nā kālā no ka noiʻi a me ka hoʻomohala ʻana, ka hana nui a me kahi hoʻonohonoho o nā huahana mua. ʻO ke keʻena nui ma Beijing, Kina, i hoʻokumu ʻia ma 2021.
ʻO GT AI, i kapa ʻia ʻo Gantu Technology, ua hoʻāla i kahi pōʻai kālā Series C1 ma hope o kahi puni Series C ma mua o kēia makahiki. Hāʻawi ʻo GT AI i ka nānā ʻana i ka ʻike kamepiula, ka nānā ʻana a me ka hoʻoholo ʻana o AI, e kālele nui ana i nā PCB hana kiʻekiʻe. Aia i loko o kāna mau huahana ka nānā naʻauao o nā hana laina hana o ka papa kaapuni paʻi maʻalahi (FPC), ka nānā ʻana i nā lako kaʻina hana FPC SMT, a me nā ʻōnaehana hoʻokele waiwai. Hoʻolālā ka ʻoihana e hoʻonui i nā wahi hana ʻē aʻe e like me nā panela solar, nā pākahi a me nā kaʻa, a me ka hoʻohana ʻana i kāna ʻenehana ʻike kamepiula i ka logistic a me nā hale kūʻai. E hoʻohana ʻia ke kālā no ka hoʻomohala ʻana i nā huahana a me ka hoʻonui ʻana i waho. Hoʻokumu ʻia ma 2018 a ʻo ke keʻena nui ma Shanghai, Kina.
Ua hoʻonui ʻo P2i i ka £15 miliona ($18.1 miliona) i ke kālā hōʻaiʻē mai ka HSBC's Growth Loan Fund. Ua hoʻomohala ʻo P2i i ka nanotechnology no ka pale ʻana i ka wai a me nā pale pale uila no ka uila. ʻO kāna uhi pale ultra-thin e hana i ka PCB IPX8 wai wai, hiki ke hōʻemi i ka e-waste, a ʻoi aku ka maikaʻi o ke kaiapuni ma mua o nā pale pale e kū nei, wahi a ka hui. E hoʻohana ʻia nā kālā no ka hoʻonui ʻana i nā hana, hoʻokomo i nā mea hana hou a komo i nā mākeke automotive a me nā lāʻau lapaʻau. Ua hoʻokumu ʻia i ka makahiki 2004 a ua hoʻokumu ʻia ma Milton Park, ʻEnelani, UK.
Ua hoʻonui ʻo Kanatu i 18 miliona euros ($17.9 miliona) i ke kālā mai 3M Ventures, Ascend Capital Partners, eFruit International a me nā mea hoʻopukapuka hou e like me Minth Group, Nordea a me Varma Mutual Pension Insurance Company. Hoʻomohala ʻo Canatu i nā mea carbon nanotube (CNT) no ka semiconductor a me nā ʻoihana kaʻa. Hoʻohana ʻia kona carbon nanotubes i nā kiʻi ʻoniʻoni lithography kiʻekiʻe ultraviolet (EUV) e pale ana i nā photomasks i ka wā photolithography. Ua ʻōlelo ka hoʻomaka ʻana i kāna membrane paʻa ponoʻī e hāʻawi i ka 97% hoʻouna hoʻokahi EUV me kahi hopena kiʻi haʻahaʻa a pololei. He kūpono hoʻi ia no ka puka helu kiʻekiʻe EUV. ʻO nā noi ʻē aʻe no kāna carbon nanotubes e loaʻa nā mea hoʻomehana kiʻi ʻoniʻoni ʻoniʻoni ʻoniʻoni no nā kiʻi ʻoniʻoni kaʻa a me nā mea ʻike lidar, nā mea ʻike paʻi 3D, a me nā mea ʻike electrochemical. "Me kēia pōʻai kālā hou, hiki iā mākou ke hoʻolōʻihi i ka ulu ʻana o ka ʻoihana i ka semiconductor a me nā mākeke automotive a hoʻonui i kā mākou laina hana automated ma Finland. ke akamai o ka ʻenehana nanotube kalapona," wahi a ka Luna Nui o Canatu ʻo Juha Kokkonen. Hoʻokumu ʻia i ka makahiki 2004 ma ke ʻano he offshoot o ka Aalto University's Nanomaterials Group a me ke keʻena nui ma Vantaa, Finland, ua hoʻonui ka hui i € 74 miliona a hiki i kēia lā.
Ua loaʻa iā Niron Magnetics he $17.5 miliona mai ka US Department of Energy. Hoʻokumu ʻo Niron Magnetics i nā mea hana kiʻekiʻe, ʻaʻohe honua iron nitride mau mea paʻa. Loaʻa nā mea magnet kiʻekiʻe i nā noi i loko o nā pahu paʻakikī, a me nā hoʻoili kaʻa uila, nā mea hana hale, nā leo leo leo, a me nā wahi ʻoihana a me nā ʻoihana e like me nā turbines makani, nā elevators, a me nā ʻōnaehana HVAC. Ua ʻōlelo ʻo Niron, ʻoi aku ka liʻiliʻi o kāna mau magnet ma mua o nā mea ʻokoʻa honua ʻokoʻa a loaʻa iā ia kahi magnetization kiʻekiʻe. "Ke hoʻomau nei nā koi o ka mākeke mālama, he mea koʻikoʻi ka hana hou no ka loaʻa ʻana o kahi pani no nā magnet i hoʻohana ʻia i ka disk heluhelu / kākau poʻo a me nā kaʻa kaʻa spindle i ka wā e pale aku ai i ka hopena o ke kaiapuni o ka mining honua a hōʻemi i ka pilikia o ka lako. nā holomua," wahi a Andy Blackburn, Luna Nui o Niron Magnetics. E hoʻohana ʻia ka hāʻawi kālā no ka hoʻomohala ʻana i nā hui ʻoihana a me ka hana hoʻokele. Hoʻokumu ʻia ma 2015 ma ke ʻano he lālā o ke Kulanui o Minnesota a he keʻena nui ma Minneapolis, Minnesota, USA.
Ua hoʻonui ʻo Actnano i $ 8 miliona ma ke kālā ulu ʻole dilutive mai Liquidity Group. Hāʻawi ʻo Actnano i nā ʻenehana nano-coating pale wai a me ke kaiapuni no nā kaʻa a me nā mea uila uila. Hāʻawi kēia ʻenehana fluorine-free, non-toxic, a me ke kaiapuni i ka pale PCB piha, me nā mea hoʻohui, nā antenna, nā LED, a me nā mea wela kiʻekiʻe. Wahi a ka hui, ua hoʻohana ʻia kona mau uhi no ka pale ʻana i nā uila ma luna o 2 miliona mau kaʻa hana, me 80% o nā kaʻa uila ma ʻAmelika ʻAmelika. E hoʻohana ʻia nā kālā e kākoʻo i ka hoʻonui ʻia ʻana o ka honua i nā mākeke automotive e like me Kelemānia, Korea, a me Iapana, a me R&D. E hoʻohana ʻia nā kālā e kākoʻo i ka hoʻonui ʻia ʻana o ka honua i nā mākeke automotive e like me Kelemānia, Korea, a me Iapana, a me R&D.E hoʻohana ʻia nā kālā e kākoʻo i ka hoʻonui ʻia ʻana o ka honua i nā mākeke automotive e like me Kelemānia, Korea a me Iapana, a me ka noiʻi a me ka hoʻomohala ʻana.E hoʻohana ʻia nā kālā no ke kākoʻo ʻana i ka hoʻonui hou ʻana o ka honua, ka noiʻi a me ka hoʻomohala ʻana i nā mākeke kaʻa e like me Kelemānia, South Korea a me Iapana. Ua hoʻokumu ʻia ma Cambridge, Massachusetts, USA, ma 2012.
Ua loaʻa iā Changzhou Zhenjing Semiconductor kahi hoʻolālā hoʻolālā o 25 miliona RMB (ma kahi o US $ 3.5 miliona) mai NCEPower. Hana ka hui i nā substrates 6-inch a me 8-inch silicon carbide (SiC). Hoʻopili ʻia kāna kaʻina hana mai ka ulu ʻana a me ka hana ʻana i nā kristal wai a hiki i ka hana ʻana, hoʻomaʻemaʻe a hoʻāʻo i nā wafers. Manaʻo ʻia lākou e hoʻomaka i ka hāʻawi ʻana i nā huahana ma 2024. Ua hoʻokumu ʻia ka hui ma 2020 a aia ke poʻo ma Changzhou, Kina.
Ua hōʻiliʻili ʻo Shineray New Materials i ʻumi miliona yuan (10 miliona yuan a i ʻole US $1.4 miliona) i kahi pōʻai kālā Pre-A mai Yuanhe Holdings, South China Venture Capital a me Nuoyan Capital. Hoʻokumu ka hoʻomaka ʻana i nā mea pili wela no nā hihia uila, me nā hihia no nā semiconductors mana. Loaʻa i kāna mau huahana nā mea kālā i hoʻopaʻa ʻia, semi-sintered conductive adhesives, nā mea kūʻai aku a me nā mea pale electromagnetic. Loaʻa nā noi i nā kaʻa ikehu hou, nā kamaʻilio RF, ka hoʻoili mana, nā photovoltaics a me nā optoelectronics. ʻO ke keʻena nui ma Shenzhen, Kina, i hoʻokumu ʻia ma 2022.
Ua loaʻa iā AST, i kapa ʻia ʻo Super Silicon Semiconductor, ke kālā B+ mai Guolian Group, China Structural Reform Fund Corporation a me Jadestone VC. Hoʻokumu ka hui i nā wafers silicon polished me ke anawaena o 200 mm a me 300 mm, nā wafers epitaxial a me nā wafers i hoʻopili ʻia i ka argon. Hoʻokumu ʻia ma 2008 a ʻo ke keʻena nui ma Shanghai, Kina.
Ua loaʻa iā Nanzhi Core Materials kahi hoʻopukapuka ʻānela mai Guofa Venture Capital. Hoʻopuka ka hoʻokuʻu ʻana i nā kristal niobate lithium grade optical no ka hoʻohana ʻana i nā kānana SAW RF, electro-optical modulators, infrared detectors, a me ka laser frequency double crystals. Hoʻokumu ʻia i ka makahiki 2021 a ua hoʻokumu ʻia ma Suzhou, Kina.
Loaʻa iā PowerEpi ke kālā hou mai SDIC Ventures. Hoʻopuka ka hoʻokuʻu ʻana i nā mea epitaxial e pili ana i ka silicon carbide (SiC). E hoʻohana ʻia ke kālā no ka hoʻonui ʻana i ka huahana a me ka hoʻonui ʻana i ka hiki. ʻO ke poʻo nui ma Dongguan, Kina, i hoʻokumu ʻia ma 2020.
Ua hoʻonui ʻo Biomemory i ka € 5 miliona (~ $ 5.2 miliona) i ke kālā hua mai eureKARE, Bpifrance, Paris Business Angels, Prunay Impact a me nā mea hoʻopukapuka pilikino o Octave Club, Flavien Kulavik, Raduan Harbichi, Eric Carril a me Jean David Benichou. Ke hoʻomohala nei ʻo Biomemory i kahi waihona ʻikepili DNA me ka hoʻohana ʻana i ka synthesis a me nā kaʻina hana replication. Hoʻopuka kēia kaʻina hana i nā ʻāpana DNA lōʻihi e hiki ke mālama ʻia e like me nā polymers inert no nā kaukani makahiki me ka ʻole o ka hoʻolilo ʻana i ka ikehu. Ma waho aʻe o kahi kiʻekiʻe kiʻekiʻe ma mua o ka tape a i ʻole SSDs, ʻōlelo ka mea hoʻomaka e hiki i kāna ʻenehana mālama mālama ke hoʻemi i nā kumukūʻai i $ 1 no megabyte, i hoʻohālikelike ʻia me $ 1 i kēlā me kēia kilobyte no nā ʻōnaehana synthesis DNA o kēia manawa. ʻO ka hope, manaʻo ʻia e hiki i $1 no TB. he mea hoʻohui piha a hoʻomau i ka microfluidic DNA hui ma hope o ka hoʻonui ʻana i ka manaʻo. E hoʻohana ʻia nā mea i loaʻa no ka hoʻonui ʻana i ka ʻenehana synthesis DNA o Biomemory, i hoʻolālā ʻia e kūpono me ka ʻikepili nui. ʻO ke keʻena nui ma Paris, Farani, i hoʻokumu ʻia ma 2021.
Ua hoʻopau ʻo InnoGrit i kahi pōʻai kālā hou. Hana ka hui i nā mea hoʻokele PCIe NVMe SSD no nā mea kūʻai aku a me nā noi ʻoihana. Hoʻopili ia i ka palekana, ka mana a me ka hana, e hāʻawi ana i nā hoʻopiʻi lehulehu a me nā ʻōnaehana pale data. Hāʻawi pū ia i nā lawelawe hoʻolālā turnkey a me nā hoʻolālā kuhikuhi. Hoʻokumu ʻia ma 2016, ke keʻena nui ma Shanghai, Kina.
Ua loaʻa iā AD Microchip (ADUC) he ʻumi miliona yuan (10 miliona yuan a ma kahi o US $1.4 miliona) ma ke kālā A+ series mai Qin Chuangyuan Xinhuo Innovation Fund a me nā mea ʻē aʻe. Hana ʻo ADUC i nā IC hōʻailona hoʻohuihui kiʻekiʻe a haʻahaʻa. Loaʻa i kāna mau huahana nā MCU 32-bit, 8-bit Flash a me OTP MCU, nā IC hoʻokele pākaukau, a me nā ICs USB Type-C Power Delivery (PD). Hoʻopili nui ia i nā mea uila uila. E hoʻohana ʻia nā kālā no ka R&D, e hoʻonui i nā laina huahana, a me ka hoʻonui ʻana i nā lako hoʻāʻo. E hoʻohana ʻia nā kālā no ka R&D, e hoʻonui i nā laina huahana, a me ka hoʻonui ʻana i nā lako hoʻāʻo.E hoʻohana ʻia nā kālā no ka noiʻi a me ka hoʻomohala ʻana, ka hoʻonui ʻana i ka laina huahana a me ka hoʻomaikaʻi ʻana i nā lako hana.E hoʻohana ʻia nā kālā no ka noiʻi a me ka hoʻomohala ʻana, ka hoʻonui ʻana i ka laina huahana a me ka hoʻomaikaʻi ʻana i nā lako hana. Hoʻokumu ʻia i ka makahiki 2013 a he keʻena nui ma Xiʻan, Kina.
Ua loaʻa iā Modulo Smart Core Microelectronics he ʻumi miliona yuan (10 miliona yuan a i ʻole US $1.4 miliona) i nā hoʻopukapuka ʻānela mai Zijin Hi-Tech Venture Capital a me nā hui ʻē aʻe. Hoʻokumu kahi hoʻomaka i nā IC analog. I kēia manawa, hāʻawi ʻia kahi ADC kiʻekiʻe kiʻekiʻe 24-bit, a kokoke nā ADC a me nā DAC haʻahaʻa haʻahaʻa i ka hana nui. Hana pū ʻo ia ma nā IC hoʻololi ʻē aʻe, nā IC interface analog olakino, nā mea hoʻokaʻawale a me nā ICs Management Management System (BMS). E hoʻohana ʻia nā kālā no ka hoʻolimalima a me ka R&D. E hoʻohana ʻia nā kālā no ka hoʻolimalima a me ka R&D. E hoʻohana ʻia ke kālā no ka hoʻopaʻa ʻana a me ka R&D.E hoʻohana ʻia ke kālā no ka hoʻopaʻa ʻana a me ka noiʻi a me ka hoʻomohala ʻana. ʻO nā noi i hoʻopaʻa ʻia e pili ana i ka uila uila, ka hana akamai, ka ikehu hou a me ka uila uila. ʻO ke keʻena nui ma Nanjing, Kina, i hoʻokumu ʻia ma 2022.
Ua loaʻa iā Soundec he ʻumi miliona yuan (10 miliona yuan a ma kahi o US $ 1.4 miliona) ma ke kālā Series B mai Qingyuan Capital a me Jolmo Capital. ʻO nā SoC e hoʻoponopono ai i nā hōʻailona leo i hoʻomohala ʻia e Soundec me ka hana kiʻekiʻe haʻahaʻa haʻahaʻa DSP processor, ADC, DAC, USB, hoʻomanaʻo a me nā pilina waiwai. Hoʻomohala pū ka hui i nā ʻāpana leo analog a me kahi ʻano o nā algorithms hoʻoili leo leo. Loaʻa i nā noi i hoʻopaʻa ʻia nā headset, nā microphones digital, a me nā huahana microphone array lehulehu no nā polokalamu IoT, nā hale akamai, nā kaʻa akamai, a me nā mea hoʻolohe. E hoʻohana ʻia ke kālā no ka hoʻomohala ʻana i nā chips hoʻoponopono leo o ka hanauna e hiki mai ana, hoʻonui i ka ʻoihana, a hoʻolimalima i nā limahana. ʻO ke keʻena nui ma Shenzhen, Kina, ua hoʻokumu ʻia ma 2017.
Ka manawa hoʻouna: Dec-12-2022